发明名称 PLATING APPARATUS
摘要 <p>The present invention provides a technology for enabling a diaphragm to be arranged in a more facilitated manner in a plating tank of a plating apparatus having a diaphragm for separating an object to be plated from an anode. The plating apparatus having a plating tank, which plating tank comprising: an opening on which an object to be plated is placed; a solution-supply tube for supplying a plating solution toward the object to be plated; an anode positioned opposed to the object to be plated; and a diaphragm for separating the object to be plated from the anode, wherein an inner wall of the plating tank is provided with a diaphragm-periphery fixing part for fixing a peripheral end of the diaphragm, the solution-supply tube is composed of a dual tube consisting of an inner tube and an outer tube, the inner tube has an inner tube part allowed to pass through a through-hole formed at a center of the diaphragm and a diaphragm through-hole fixing part for fixing the through-hole, and the outer tube has an engaging part for fixing the inner tube with the inner tube part accommodated and further has a tank-fixing part to be fixed in the plating tank.</p>
申请公布号 KR20070054089(A) 申请公布日期 2007.05.28
申请号 KR20060084954 申请日期 2006.09.05
申请人 ELECTROPLATING ENGINEERS OF JAPAN LIMITED 发明人 UCHIUMI YUJI
分类号 C25D17/00 主分类号 C25D17/00
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