SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor device and a method for manufacturing the same are provided to prevent the contact between an electrode terminal and a base substrate and to perform securely a wire bonding process on a passive element using an improved arrangement of the electrode terminal and the passive element. A semiconductor device includes a passive element, a semiconductor element, and a base substrate. The passive element(15) has a pillar type body portion and a pair of electrode terminals(16) at both end portions of the body portion in an axis direction. The semiconductor element is connected to at least one electrode terminal through a bonding wire. The base substrate is used for mounting the passive element and the semiconductor element via an adhesive layer. The body portion of the passive element is nearly parallel with a surface of the base substrate. The contact between the electrode terminal and the base substrate is prevented.