| 摘要 |
<p>Disclosed is a non-thermoplastic polyimide film obtained by imidating a polyamic acid-containing solution which is obtained by reacting an aromatic diamine containing 3,4'-diaminodiphenyl ether and 2,2-bis{4-(4-aminophenoxy)phenyl}propane with an aromatic acid dianhydride by a specific polymerization process. This polyimide film exhibits good adherability with respect to a metal foil via an adhesive layer containing a thermoplastic polyimide without being subjected to a special surface treatment.</p> |
