发明名称 |
Conductive substrate for use in printed circuit boards, comprises copper layer formed on at least one side of base board, and gold-copper layer formed on copper layer |
摘要 |
<p>A conductive substrate (51) comprises a base board, a copper layer formed on at least one side of the base board, and a gold-copper layer formed on the copper layer. The copper layer is made of copper or copper alloy. The gold-copper layer is made of an alloy of gold and copper. Independent claims are included for: (1) a motor, e.g. vibration motor, comprising a conductive substrate and a brush for forming a current path; and (2) a metal terminal for electrical contact, comprising a copper layer and a gold-copper layer formed on the copper layer.</p> |
申请公布号 |
FR2893813(A1) |
申请公布日期 |
2007.05.25 |
申请号 |
FR20060003726 |
申请日期 |
2006.04.26 |
申请人 |
SAMSUNG ELECTRO MECHANICS CO LTD |
发明人 |
LEE SEOUNG JAE;KIM BAE KYUN;AN SANG GIL;JI KUM YOUNG;KIM YOUNG TAE |
分类号 |
H05K1/03;H02K3/50 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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