发明名称 Conductive substrate for use in printed circuit boards, comprises copper layer formed on at least one side of base board, and gold-copper layer formed on copper layer
摘要 <p>A conductive substrate (51) comprises a base board, a copper layer formed on at least one side of the base board, and a gold-copper layer formed on the copper layer. The copper layer is made of copper or copper alloy. The gold-copper layer is made of an alloy of gold and copper. Independent claims are included for: (1) a motor, e.g. vibration motor, comprising a conductive substrate and a brush for forming a current path; and (2) a metal terminal for electrical contact, comprising a copper layer and a gold-copper layer formed on the copper layer.</p>
申请公布号 FR2893813(A1) 申请公布日期 2007.05.25
申请号 FR20060003726 申请日期 2006.04.26
申请人 SAMSUNG ELECTRO MECHANICS CO LTD 发明人 LEE SEOUNG JAE;KIM BAE KYUN;AN SANG GIL;JI KUM YOUNG;KIM YOUNG TAE
分类号 H05K1/03;H02K3/50 主分类号 H05K1/03
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