| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a compact LED device having high heat dissipation capability at low manufacturing cost. <P>SOLUTION: An LED 20 is formed by using terminal leads 14 and 15 molded not by a die set, but by a roller. When this step is used, the terminal leads can be terminated with a plurality of terminals 1, 2, 3, 4, 5, and 6. Consequently, higher heat dissipation becomes possible. The LED can be manufactured by using an LED chip 12 which emits light only from the top or a side. A sideward light LED can have a reflector 16 constituted in a device to reflect light upward. <P>COPYRIGHT: (C)2007,JPO&INPIT |
