PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMING METHOD AND METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which ensures excellent plating resistance when used for forming a cured material layer on a patterned surface resin layer formed on a substrate with a formed circuit.

SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound and (C) a photopolymerization initiator, wherein when the total amount of the components (A) and (B) is considered to be 100 parts by mass, the component (B) contains 10-20 parts by mass of a vinyl urethane compound represented by formula (1), 15-25 parts by mass of an ethoxylated trimethylolpropane triacrylate compound represented by formula (2) and 5-15 parts by mass of a nonylphenyl polyethylene glycol acrylate compound represented by formula (3).

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