| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board with less short circuit defects between conductive circuits and excellent in circuit formability in the pattern formation of a conductive circuit of a printed wiring board by the semi-additive method. SOLUTION: An interlayer insulating resin to which a copper foil, which has a thickness of 5μm or less and is manufactured with a current density greater than the current density at the time of the formation of an electric copper plated layer that will be a conductive circuit pattern, is laminated on the upper and lower surfaces of an inner layer circuit substrate and an etching liquid having acid and hydrogen peroxide as main components, not including halogen, is used for the etching of copper of other than the conductive circuit pattern. COPYRIGHT: (C)2007,JPO&INPIT
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