| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor cooling device that enables the entire cooling system size to be reduced, and improves the cooling efficiency in comparison with conventional cooling devices, by using a bi-laminar spiral pipe in an evaporator to reduce a pipe resistance and increase a cooling speed, in a device employing the evaporator to cool the semiconductor device. SOLUTION: A semiconductor cooling evaporator 1, an accumulator 2, a compressor 3, a condenser 4, dryer 5, and a capillary tube 6, are connected through a pipe 7 to form a cooling cycle. Because a bi-laminar spiral pipe is built in the evaporator 1; a resistance due to the pipe is low in a gas flow, and a volume for cooling the semiconductor device is large, resulting in a fast cooling speed. In addition, a circulating volume of cooling medium is large, so that a cooling structure suitable for high density and high temperature cooling can be obtained. COPYRIGHT: (C)2007,JPO&INPIT
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