发明名称 |
Packaging of electronic components such as chips that are mounted on a circuit board have contact pads |
摘要 |
The packaging of an electronic module such as a chip [20] mounted on a main connecting surface [31] has a housing [30] of moulding material [15]. The component has leads [28] connected to contact pads [32]. These and the main connecting surface are bonded to metal areas on a circuit board. |
申请公布号 |
DE102005055477(A1) |
申请公布日期 |
2007.05.24 |
申请号 |
DE20051055477 |
申请日期 |
2005.11.22 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
HAAG, FRIEDER;HEITZ, MARKUS |
分类号 |
H01L23/28;H01L21/50;H01L23/50 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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