| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the flexibility of wiring, and to prevent a substrate from being broken. <P>SOLUTION: A semiconductor device comprises a semiconductor substrate; a surface side wiring pattern including high frequency wiring formed on the surface of the semiconductor substrate for transmitting a high frequency signal higher than a predetermined frequency; a ground plate formed on the rear surface of the semiconductor substrate; and a rear surface side wiring pattern including low frequency wiring formed, in a region on the rear surface of the semiconductor substrate excepting a ground plate for transmitting a low frequency signal or a fixed voltage. The semiconductor substrate is packaged on a base substrate in a state of the surface thereof facing the principal surface of the base substrate. The semiconductor device further comprises a pad formed on the surface of the semiconductor substrate such that it is communicated with a surface side wiring pattern, and connected with the base substrate by flip chip bonding; and a pad formed on the rear surface of the semiconductor substrate such that it is communicated with a rear surface side wiring pattern, and connected with the base substrate by wire bonding. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
