| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an apparatus and an associated method for receiving and positioning a plurality of spaced-apart power semiconductor modules. <P>SOLUTION: Each of receptacles (12) has a stopper means (20) in the apparatus, by which a main face of each power semiconductor module (40) is positioned in alignment and in parallel with a first main face (14) of a molded positioning body (10). Beginning at a second main face (16), each receptacle (12) is conically formed in the direction of the first main face (14) in at least one fragmentary portion (18). The associated method makes use of the apparatus for aligning and fixing the power semiconductor modules (40) in their position, and then employs a coating method for full-surface or partial coating of the first main faces of the power semiconductor modules (40) with a material (60). <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
