| 摘要 |
PROBLEM TO BE SOLVED: To simply prevent a sealing plate from contacting an organic EL element, when jointing an element substrate sealing and housing the organic EL element to the sealing plate. SOLUTION: The element substrate 11 of the organic light-emitting device 10 has a frame-shaped bank part 11a at the outer peripheral part thereof. A first electrode 12, an auxiliary electrode 13, an inter-layer insulating layer 14, an organic EL layer 15 containing an organic light-emitting material, and a second electrode 16 are laminated on a recessed part of the element substrate 11 surrounded by the bank part 11a. The first electrode 12 and the second electrode 16 are connected to a first electrode extraction wiring 17 and a second electrode extraction wiring 18, respectively, which are extracted to the outside going over the bank part 11a. The sealing plate 19 is jointed to a surface of the element substrate 11, the first electrode extraction wiring 17, and the second electrode extraction wiring 18 at the bank part 11a. COPYRIGHT: (C)2007,JPO&INPIT
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