| 摘要 |
A system and methods are described for the evaluation of the integrity of a wafer cassette and the disposition thereof based upon evaluation of wafer measurement data obtained using a wafer sorter cassette mapping system utilized in-line during wafer sorting operations. One method comprises initially placing two or more wafers into two or more of a plurality of slots in the wafer cassette. A wafer sorter cassette mapping sensor affixed to the wafer sorter is then scanned over the two or more wafers in the slots of the wafer cassette, using a wafer sorter. The positions of the wafers in the wafer cassette are then measured while scanning the sensor over the wafers. The wafer position measurements are then evaluated using a modeling system to determine slot positions within the cassette associated with the wafer position measurements, and a determination of the integrity of the cassette is generated based on the slot position determinations. If the integrity determination indicates that the cassette is deformed beyond a predetermined value, the cassette may be replaced and/or the measurement data may be stored in a data base for further trend analysis or for replacement forecasting.
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