| 发明名称 |
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE AND CIRCUIT MEMBER CONNECTING METHOD |
| 摘要 |
<p>An adhesive composition is provided with an adhesive component and conductive particles (10) dispersed in the adhesive component. The conductive particle (10) is provided with a base material particle (1) constituting the center portion, a metal plating layer (3) covering at least a part of the surface of the base material particle (1), and a plurality of metal fine particles (2) arranged inside the metal plating layer (3) and on the surface of the base material particle (1).</p> |
| 申请公布号 |
WO2007058159(A1) |
申请公布日期 |
2007.05.24 |
| 申请号 |
WO2006JP322628 |
申请日期 |
2006.11.14 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD.;YOKOZUMI, TOMOMI;FUJII, MASAKI;TAKEMURA, KENZOU |
发明人 |
YOKOZUMI, TOMOMI;FUJII, MASAKI;TAKEMURA, KENZOU |
| 分类号 |
C09J201/00;C09J9/02;H01B1/00;H01B1/20;H01B5/00;H01B5/16;H01L21/60;H01R11/01;H05K3/36 |
主分类号 |
C09J201/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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