CIRCUIT MATERIAL, MULTI-LAYER CIRCUITS, AND METHODS OF MANUFACTURE THEREOF

摘要

An adhesive for a circuit material, comprises a blend of a cure system; and a solid epoxy resin and a nitrile rubber functionalized with epoxy-reactive groups, wherein the solid epoxy resin and the nitrile rubber are reacted to form an adduct prior to blending with the cure system. The adhesive has low dendritic growth and improved solder resistance.