| 发明名称 |
Method for producing an electrical contact for an optoelectronic semiconductor chip |
| 摘要 |
A method for producing an electrical contact of an optoelectronic semiconductor chip ( 1 ), comprising providing a mirror layer ( 2 ), comprised of a metal or metal alloy, over the semiconductor chip; providing a protective layer ( 3 ) over said mirror layer; providing a layer sequence of a barrier layer and a coupling layer ( 5 ) over said protective layer; and providing a solder layer ( 8 ) over said layer sequence.
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| 申请公布号 |
US2007117235(A1) |
申请公布日期 |
2007.05.24 |
| 申请号 |
US20070654224 |
申请日期 |
2007.01.16 |
| 申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
STEIN WILHELM;FEHRER MICHAEL;BAUR JOHANNES;WINTER MATTHIAS;PLOESSL ANDREAS;KAISER STEPHAN;HAHN BERTHOLD;EBERHARD FRANZ |
| 分类号 |
H01L21/00;H01L21/44;H01L33/32;H01L33/40 |
主分类号 |
H01L21/00 |
| 代理机构 |
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