发明名称 ELASTIC SURFACE WAVE DEVICE, MODULE DEVICE, OSCILLATION CIRCUIT, AND ELASTIC SURFACE WAVE DEVICE FABRICATION METHOD
摘要 It is possible to provide a small-size SH wave-type SAW device as a surface wave device using a crystal substrate having a large Q value and an excellent frequency aging characteristic. The elastic surface wave device includes a piezoelectric substrate and an IDT electrode formed of an alloy containing Al as a main component on the piezoelectric substrate and uses an excitation wave as the SH wave. The piezoelectric substrate is a flat quartz plate in which the cut angle ? of the rotary Y-cut quartz substrate is set in a range -64.0 degrees < ? < -49.3 degrees and the elastic surface wave propagation direction is set to 90 degrees ± 5 degrees with respect to the crystal X axis. When the oscillating elastic surface wave has a wavelength ?, the electrode film thickness H/? standardized by the wavelength of the IDT electrode is set to 0.04 < H/? < 0.12. The quartz substrate is etched with a thickness not smaller than 0.002 µm. Thus, it is possible to obtain an SH wave-type elastic surface wave device.
申请公布号 WO2007037457(A9) 申请公布日期 2007.05.24
申请号 WO2006JP319633 申请日期 2006.09.25
申请人 EPSON TOYOCOM CORPORATION;OWAKI, TAKUYA;MITSUI, YUJI;YOSHIZAWA, YUZURU 发明人 OWAKI, TAKUYA;MITSUI, YUJI;YOSHIZAWA, YUZURU
分类号 H03H9/25;H01L41/08;H01L41/09;H01L41/18;H01L41/22;H01L41/332;H03H3/08;H03H9/145;H03H9/64 主分类号 H03H9/25
代理机构 代理人
主权项
地址