| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming a patterned cured material film by a photoresist method and giving a cured film having excellent flexibility and hot press resistance in addition to excellent flame retardancy. <P>SOLUTION: The preferred photosensitive resin composition contains (A) an alkali-soluble polymer, (B) a first photopolymerizable compound having at least one ethylenically unsaturated group and 20-80 wt.% of bromine atoms based on the total amount of the compound, (C) a second photopolymerizable compound other than the component (B) and having at least one ethylenically unsaturated group, and (D) a photopolymerization initiator. <P>COPYRIGHT: (C)2007,JPO&INPIT |
