| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure of a substrate storing box which is improved in heat dissipation performance while at the same time responding to the needs for reduction in size. SOLUTION: This is the heat dissipation structure of the substrate storing box which comprises a box body 3 wherein a circuit board 1 is stored from which heat should be dissipated, a substrate support 7 for supporting the circuit board 1 in a heat conductible state within the box body 3, and an installation portion 11 to a vehicle which is formed in the box body 3 to install the box body 3 to a vehicle. In the heat dissipation structure of the substrate storing box, heat from the circuit board 1 which is transferred via the substrate support 7 is let go to the vehicle via the wall of the box body 3 and the installation portion 11 to the vehicle. The wall of the box body 3 which is most subject to the outside heat influence consists of a heat dissipation board 5 formed of a laminate 6 of different kinds of metals consisting of a low heat conduction material 6A as an outside layer, and a high heat conduction material 6B as an inside layer. COPYRIGHT: (C)2007,JPO&INPIT
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