摘要 |
A light emitting device includes: a light emitting element; and a substantially rectangular package body in which the light emitting element is contained and a concave portion is formed. The concave portion has a bottom surface on which the light emitting element is disposed, and is filled with a transparent sealing resin for covering the light emitting element. Further, the sealing resin has a surface serving as an emitting surface, from which light is extracted. The package body includes: a reflection surface being an inclined plane provided along a short side of a depressed region toward the emitting surface, when seen from above the emitting surface; and a die bonding region and a wire bonding region on a bottom surface of the depressed region. Further, the depressed region has a depth being substantially equal to or less than a height of the active layer of the light emitting element.
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