| 发明名称 |
Hardened porous polymer chemical mechanical polishing (CMP) pad |
| 摘要 |
A batch of porous polymer chemical-mechanical polishing (CMP) pads for shipment is described. The CMP pads within the batch are for or use in a semiconductor chip manufacturing process. The CMP pads within the batch exhibit an average dynamic modulus within a range of 65 MPa to 80 MPa inclusive when measured at 100 Hz.
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| 申请公布号 |
US2007117393(A1) |
申请公布日期 |
2007.05.24 |
| 申请号 |
US20050284486 |
申请日期 |
2005.11.21 |
| 申请人 |
TREGUB ALEXANDER;NARAYANAN SATISH |
发明人 |
TREGUB ALEXANDER;NARAYANAN SATISH |
| 分类号 |
C03C15/00;B24D11/02;H01L21/302;H01L21/461 |
主分类号 |
C03C15/00 |
| 代理机构 |
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