| 摘要 |
A process of dry powder coating a thermo-curing resin onto a heat sensitive substrate such as chip board, fibreboard or wood is disclosed. The process requires the bare substrate (1) to be coated with the uncured powder (1') and cured by irradiation with infrared in a curing oven (3). The curing oven uses ceramic glass elements (5) as the source of infrared radiation. The process may also be applied advantageously to components of heat insensitive material such as steel. |
