| 摘要 |
PROBLEM TO BE SOLVED: To realize high versatility for electric connection in a semiconductor device constituted of a semiconductor element, while securing good heat dissipation and avoiding adverse influences due to heat generation. SOLUTION: The semiconductor device 10 includes the semiconductor element 11, a lead frame 12 made of a flat metallic plate, and a multilayered wiring board 13 which is a laminate of a plurality of wiring layers. The board 13, the lead frame 12, and the element 11 are stacked in this order. The multilayered wiring board 13 includes, on the side with the lead frame 12 stacked, connection terminals 13a for electrically connecting with the semiconductor element 11. The lead frame 12 includes reliefs 12a for exposing the terminals 13a to the side of the element 11 corresponding to the positions where the terminals 13a are located. COPYRIGHT: (C)2007,JPO&INPIT
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