CURABLE RESIN COMPOSITION, METHOD FOR FORMING PROTECTIVE FILM AND PROTECTIVE FILM

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition forming a protective film having excellent adhesiveness to a substrate or an underlying or an upper layer, suppressing formation of sublimates during baking of a step of forming the film, satisfying high heat resistance and high surface hardness and having excellent load resistance while heating and performances flattening the difference in level of a color filter formed on the underlying substrate.

SOLUTION: A radiation-sensitive resin composition comprises (A) a polymer polymerized in the presence of a specific thiocarbonylthio compound by living radical polymerization and having≤1.7 ratio (Mw/Mn) of the weight-average molecular weight (Mw) to the number-average molecular weight (Mn) and expressed in terms of polystyrene measured by a gel permeation chromatography and (B) a cationically polymerizable compound. (A) The polymer has carboxy groups or oxiranyl groups or oxetanyl groups.

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