发明名称 Isolated vertical power device structure with both N-doped and P-doped trenches
摘要 A method for manufacturing an isolated vertical power device includes forming, in a back surface of a first conductivity type substrate, back isolation wall trenches that surround a conduction region of the device. In a front surface of the substrate, front isolation wall trenches are formed around the conduction region. Thereafter, a film containing a second type dopant is deposited in the front and back isolation wall trenches. In the conduction region on the back surface, conduction region trenches are formed inside the perimeter of the isolation wall trenches. A first type dopant is deposited in the conduction region trenches. The dopants are diffused from the conduction region trenches and isolation wall trenches to form a first conductivity type conduction region structure and a second conductivity type isolation wall.
申请公布号 US2007117360(A1) 申请公布日期 2007.05.24
申请号 US20050284979 申请日期 2005.11.21
申请人 STMICROELECTRONICS, INC. 发明人 BLANCHARD RICHARD A.
分类号 H01L21/04 主分类号 H01L21/04
代理机构 代理人
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