发明名称 SUBSTRATE TREATING APPARATUS
摘要 A substrate treating apparatus for treating substrates with a treating liquid is disclosed. The apparatus includes a treating tank for storing the treating liquid, and treating the substrates as immersed in the treating liquid, a chamber surrounding the treating tank, a supply device for supplying an inert gas containing an organic solvent into the chamber, a lift mechanism vertically movable, while supporting the substrates, between a process position in the treating tank and a wait position above the treating tank and inside the chamber, a tank temperature control device for controlling temperature of the treating tank, a chamber temperature control device for controlling temperature of the chamber, and a control device for causing the tank temperature control device and the chamber temperature control device to perform heating treatment at least while the inert gas containing the organic solvent is supplied from the supply device.
申请公布号 US2007113744(A1) 申请公布日期 2007.05.24
申请号 US20060560121 申请日期 2006.11.15
申请人 AIHARA TOMOAKI 发明人 AIHARA TOMOAKI
分类号 A23B4/00 主分类号 A23B4/00
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