LOW PROFILE IMAGE SENSOR PACKAGE

摘要

A microelectronic element such as an imaging semiconductor chip (72) is packaged by bonding a lid wafer (20') having recesses (32) open to its bottom surface to a device wafer (50) including a plurality of the microelectronic elements or chips, so that the recesses overlie active regions such as imaging regions (58) of the device wafer. Where the devices include microlenses (60) associated with an imaging region of each chip, the microlenses may be received in the recesses. Land regions (24') of the lid wafer may be disposed very close to the top surface (52) of the device wafer, as for example, abutting the top surface of the device wafer or separated from such top surface only by an extremely thin coating of a bonding material such as an adhesive or solder. The bonded lid wafer and device wafer may be severed to form individual units (70) . The top surface (22) of the lid wafer may be precisely parallel with the top surface of the device wafer.