| 摘要 |
<p>The electronic control enclosure includes devices and methods for removingheat energy from the electronic components of an electronic control unit. Thecomponents are mounted to a substrate and are protectively housed in an interiorchamber of an environmentally sealed enclosure housing. Electrical communicationis established with the components via a header assembly that includes plug receptacles.To remove heat generated by the components from the enclosure housing, one ormore heat sinks are disposed through the enclosure housing such that the heatsinks have an interior surface exposed to the interior chamber and an exteriorsurface exposed to the exterior of the enclosure housing. In other embodiments,the enclosure housing may be made of a heat conductive material and the heat sinkis integral with the enclosure housing. In one aspect, a spring urges the componentsagainst the interior surface. In another aspect, the components are mountedto and directly contact the interior surface.</p> |
