发明名称 METHOD FOR CONNECTING PRINTED CIRCUIT BOARDS
摘要 <p>To provide a method for connecting printed circuit boards with high connection reliability, while avoiding the problem of shorting even with a fine pitch. A method for connecting printed circuit boards (PCB) containing metal wiring, or connecting a printed circuit board (PCB) containing metal wiring with a metal lead wire or a metal contact, which method includes a step of thermocompression bonding of an adhesive film with connectors, the adhesive film being composed of an adhesive composition comprising a thermoplastic resin and organic particles, wherein the viscosity decreases as the applied thermocompression force increases at a temperature of 100-250°C.</p>
申请公布号 WO2007058897(A1) 申请公布日期 2007.05.24
申请号 WO2006US43658 申请日期 2006.11.09
申请人 3M INNOVATIVE PROPERTIES COMPANY;KAWATE, KOHICHIRO;KAWATE, YOSHIHISA 发明人 KAWATE, KOHICHIRO;KAWATE, YOSHIHISA
分类号 H05K3/36;H05K1/14 主分类号 H05K3/36
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