| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a small multilayer substrate module in which the number of mounted components for matching and matching via holes is decreased. <P>SOLUTION: The multilayer substrate module comprises a ceramic multilayer substrate 1, an IC 4 for antenna switch, surface acoustic wave duplexers 2 and 3 mounted on the upper surface of the ceramic multilayer substrate 1, and a plurality of mounted components 7 for matching. A via hole conductor 13 for ground connected electrically with a ground conductor layer 11, and a via hole conductor 14 for signal (including a via hole conductor for matching) connected electrically with a signal line 16 are provided in the ceramic multilayer substrate 1. While taking account of shift to the low frequency side by parasitic inductance Ls generated by the ground conductor layer 11, position of the attenuation pole of the surface acoustic wave duplexer units 2 and 3 is previously shifted to the high frequency side from a position set when they are mounted on the multilayer substrate module 21. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
