发明名称 |
Wiring substrate and electronic parts packaging structure |
摘要 |
In a wiring substrate of the present invention in which a bump of an electronic parts is bonded to a connection pad of a wiring pattern provided on an insulating film by an ultrasonic flip-chip packaging, a via hole into which a via post acting as a strut to support the connection pad upon the ultrasonic flip-chip packaging is filled is arranged in the insulating film under the connection pad.
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申请公布号 |
US2007114673(A1) |
申请公布日期 |
2007.05.24 |
申请号 |
US20070655238 |
申请日期 |
2007.01.19 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
MURAYAMA KEI;SUNOHARA MASAHIRO |
分类号 |
H01L23/12;H01L23/48;H01L21/60;H01L23/00;H01L23/485;H01L23/498;H01L23/522;H05K1/02;H05K1/11;H05K3/32 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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