发明名称 Conductor-clad laminate, wiring circuit board, and processes for producing the same
摘要 In a roll-to-roll step, an adhesive solution is applied to a release film 1 including a polyethylene terephthalate film and this film 1 is passed through a drying oven 500 regulated to 60 to 150° C. to thereby form an adhesive layer 2 . Subsequently, an insulating film 3 including a polyimide film is laminated on the adhesive layer 2 at room temperature (about 25° C.) to thereby produce a layered product 6 including the release film 1 , adhesive layer 2 and insulating film 3 . Next, the release film 1 is stripped from the layered product 6 and a conductor film 4 including a copper foil is laminated to the adhesive layer 2 to thereby produce a conductor-clad laminate 8.
申请公布号 US2007113961(A1) 申请公布日期 2007.05.24
申请号 US20060603048 申请日期 2006.11.22
申请人 NITTO DENKO CORPORATION 发明人 YAMUCHI DAISUKE
分类号 B44C1/17;B32B37/12;B32B37/26 主分类号 B44C1/17
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