| 摘要 |
PROBLEM TO BE SOLVED: To provide a residue removing method capable of removing the residue of a film material of a second film adhered to the inner peripheral surface of an opening of a first film when forming the second film into a prescribed pattern at the bottom of the opening formed on a substrate, and a micromachine device manufacturing method using the same method. SOLUTION: The second film is formed into the prescribed pattern at the bottom of the opening of the first film formed on the substrate. Subsequently, a resin material is filled in the opening of the first film and the resin material is hardened, and thereby the residue made of a film material of the second film is adhered to the resin material and the resin material adhered with the residue is removed from the opening. COPYRIGHT: (C)2007,JPO&INPIT
|
