| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor bump connection structure wherein appropriate connection can be ensured without using flux, the contact area of a solder bump with an electrode of an electronic part can be controlled to be specified at all times, and no shortcircuiting among the bumps occurs during reflow and of which a connection portion is superior in reliability, and to provide its manufacturing method. SOLUTION: In a flip-chip connection structure wherein an electrode 2 of a first electronic part and an electrode 6 of a second electronic part are connected by a solder bump 3, metal compound layers 4 and 7 are formed on a bonding boundary between the electrodes 2 and 6 of the solder bump 3, and a narrow part 10 is formed on the side surface of the solder bump 3, namely, on a host-phase side adjacent to an intermetallic compound layer in at least one bonding part on the sides of the first and second electronic parts. The narrow part 10 reduces stress generating due to the difference of thermal expansion coefficients, on the side of the solder host phase. COPYRIGHT: (C)2007,JPO&INPIT
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