发明名称 |
METHOD OF MOLDING RIGID POLYURETHANE FOAMS WITH ENHANCED THERMAL CONDUCTIVITY |
摘要 |
The present invention is to a molded rigid polyurethane foam for application in appliance, having a reduced thermal conductivity at densities between 33 and 38 kg/m<SUP>3</SUP> and a process for the production of such foams. The molded rigid polyurethane foam have a ratio of applied foam density (kg/m3) to lambda (mW/mK), measured at 10°C, 24 hours after foam production from 1.65 and to 2.15 and are obtained by the process of injecting into a closed mold cavity under reduced pressure a reaction mixture at a packing factor of 1.1 to 1.9 and the reaction mixture comprises: A) an organic polyisocyanate; B) a physical blowing agent, C) a polyol composition containing at least one polyol with a functionality of 3 or greater and a hydroxyl number between 200 and 800 and a water content of 0 to 2.5 weight percent of the total polyol composition; D) catalyst and E) auxiliary substances and/or additives. |
申请公布号 |
WO2007058793(A1) |
申请公布日期 |
2007.05.24 |
申请号 |
WO2006US42979 |
申请日期 |
2006.11.03 |
申请人 |
DOW GLOBAL TECHNOLOGIES INC.;DE VOS, HANS, A. G.;PARENTI, VANNI |
发明人 |
DE VOS, HANS, A. G.;PARENTI, VANNI |
分类号 |
C08G18/08;C08J9/12 |
主分类号 |
C08G18/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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