SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRIBUTED PADS
摘要
A semiconductor package that includes a semiconductor die, an insulation around the die, and a conforming conductive pad coupled to an electrode of the die.
申请公布号
WO2007058854(A2)
申请公布日期
2007.05.24
申请号
WO2006US43520
申请日期
2006.11.10
申请人
INTERNATIONAL RECTIFIER CORPORATION;PAVIER, MARK;SAWLE, ANDREW M.;STANDING, MARTIN
