| 摘要 |
969,483. Semi-conductor devices. TELEFUNKEN A.G. Sept. 30, 1960 [Sept. 30, 1959], No. 33608/60. Heading H1K. To improve the cooling of a semi-conductor device 5 attached to a plate 3, a foil 1 of plastically deformable material is placed across the top of the envelope 2 before the insertion of the device so that the foil is carried in with the device and forms a good heat-conducting layer between the plate 3 and the envelope. The foil may be indium or a tin-indium mixture and heat conductivity to the envelope may be further improved by heating the device so as to just melt the foil. The envelope is sealed to a base 7. The plate 3 may initially be soldered or welded in a heat conducting cylinder before insertion in the envelope or a plates-rod or hollow cylinder may be spot-welded to the end of the plate. The envelope may be of glass, metal or ceramic or the envelope may be of a different material from its base. |
