| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board which forms satisfactory holes in a copper-clad laminate board with a low processing energy of a CO<SB>2</SB>laser for forming the holes in the laminate board. SOLUTION: The method of manufacturing a printed wiring board using a multilayer laminate board comprises a step of forming a process layer (5a) having a light absorption degree of 0.05 or higher at a wavelength of 9.3-10.6μm on a copper foil (4a) surface of a surface layer, and then irradiating the process layer (5a) with a CO<SB>2</SB>laser from the process layer (5a) side to form holes (6) in the copper foil (4a) of the surface layer and its lower layer (3a), thus accurately forming the holes (6) of a specified diameter with a low processing energy. This reduces the damage to the inner layer copper foil to manufacture a printed wiring board superior in workability. COPYRIGHT: (C)2007,JPO&INPIT |
