| 摘要 |
The miniaturization of the system in package which laminates a plurality of semiconductor chips on a wiring substrate via a die attach film is promoted. In the system in package (SiP) which laminates memory chips and microcomputer chip via die attach film on wiring substrate, by forming metal plate in the chip mounting region of wiring substrate, and mounting memory chip of an undermost layer on this metal plate, the flatness of the chip mounting region of wiring substrate is secured, and die attach film which intervenes between metal plate and memory chip of an undermost layer is made the same quality as die attach film which intervenes between chips (between memory chips and between memory chip and microcomputer chips), and the same thickness.
|
