SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

At least one semiconductor element and a plurality of conductive members (6) for terminals for external connection are arranged on an adhesive tape (2), and electrodes of the semiconductor element and the conductive members (6) are connected electrically. The semiconductor element and the conductive members (6) are encapsulated on the adhesive tape (2) with an encapsulation resin (12), and the adhesive tape (2) is separated from the semiconductor device. The conductive members (6) are separately formed pellet-shaped conductive members and exposed from the encapsulation resin (12) for serving as terminals for external connection (mounting terminals). Consequently, different semiconductor devices comprising semiconductor elements of different kinds can be manufactured only by changing arrangement of the conductive members (6) without requiring special components for exclusive use.