发明名称 LEAD FRAME, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND ELECTRONIC MACHINE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a lead frame or the like capable of reducing a resin bur which breaks and peels off on a sag of a lead terminal. <P>SOLUTION: The protrusion 131 of the lead frame 101 protrudes from a part 111 in a third region A3 in the lead terminal 110. An air vent 301 of a sealing mold is provided between lead terminals 110, thereby blocking the part 111 of the lead terminal 110 from the air vent 301 in the third region A3 by the protrusion 131. As a result, resin flowing out from the air vent 301 does not attach to the part 111 of the lead terminal 110. Thus, the resin bur 210 can be divided into two on the sag of the terminal 110. A resin bur 211 coupled with a resin package 200 is shorter than conventional ones and thus harder to break, and since a resin bur 212 not coupled with the resin package 200 has weak adhesion with the lead terminal 110, it is peeled off and removed during a resin cutting process or the like. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007128998(A) 申请公布日期 2007.05.24
申请号 JP20050319021 申请日期 2005.11.02
申请人 SHARP CORP 发明人 NAKAZAWA YASUHISA
分类号 H01L23/50 主分类号 H01L23/50
代理机构 代理人
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