| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for inexpensively and stably manufacturing a multilayer wiring board having a cable section with a high integration degree capable of loading narrow pitch CSP. SOLUTION: The manufacturing method of the multilayer flexible wiring board having the cable section on an outer layer includes (a) a process for manufacturing an inner layer core substrate; (b) a process for forming an opening of copper foil in a conduction hole forming part on an outer layer side in a double sided copper clad laminate having flexibility, and forming a circuit pattern comprising an opening of a conduction hole forming part on an inner layer side; (c) a process for forming a cover ray on the circuit pattern to make it to be an outer layer built-up layer, laminating the outer layer built-up layer by turning a side where the cover ray is formed to a side of the inner layer core substrate, and forming the lamination circuit substrate; (d) a process for performing laser processing on the conduction hole forming part of the outer layer side through the opening of copper foil, and forming a conduction hole in the lamination circuit substrate; and (e) a process for performing a conduction processing on the conduction hole, and forming a via hole with electrolytic plating. COPYRIGHT: (C)2007,JPO&INPIT |
