| 摘要 |
PROBLEM TO BE SOLVED: To prevent damage of a ceramic substrate in forming a resin layer on a surface of the ceramic substrate, to reduce dispersion of thickness of a compound wiring board, and to ensure sufficient surface smoothness. SOLUTION: The ceramic substrate and a resin sheet are overlapped and arranged. They are stuck by vacuum lamination. The ceramic substrate and the resin sheet are arranged between a heating plane and a film, a space formed by the heating plane and the film is pressure-reduced, and the film expanded to a direction of the heating plane is pressed to the ceramic substrate and the resin sheet with heating gas so as to laminate them as vacuum lamination. It is desirable to perform resin curing with heating atmosphere as a medium after lamination. COPYRIGHT: (C)2007,JPO&INPIT |
