SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device excellent in heat radiation and thermal resistance.

SOLUTION: The semiconductor light-emitting device comprises chip LEDs 3-6 on a silicon submount element 2. On the silicon submount element 2, a wiring pattern 7 consists of a chip connecting terminal 7a for connecting the chip LEDs 3-6, an external connecting terminal 7b, and a plurality of lead portions 7c connecting corresponding chip connecting terminal 7a and the external connecting terminal 7b. An area of the chip connecting terminal 7a is set larger than that of region where the chip connecting terminal 7a and the chip LEDs 3-6 are superposed each other.

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