发明名称 METHOD AND APPARATUS FOR REMOVING UNNEEDED RESIN, AND MOLDED LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To provide a removal method of an unneeded resin capable of precisely poking a desired position by a break pin reliably even if a molded lead frame is positioned easily. SOLUTION: The shape of an engagement section 2a at a pin side formed at the tip of the break pin 2 is set to a tapered projection, the tip of the projection is formed to be spherical, and the shape of an engagement section 7a at a resin side is set to a tapered recess, where the engagement section 7a is formed at the exposed section of a runner 7 and a gate 8 exposed by a first through hole 9A and a second one 9B formed on the molded lead frame 5. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007128930(A) 申请公布日期 2007.05.24
申请号 JP20050317836 申请日期 2005.11.01
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HASE YASUTAKA
分类号 H01L21/56 主分类号 H01L21/56
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