Elektronische Vorrichtung mit einem Al- oder Co-Teilchen enthaltenden Lot aus einer Zn-Al-Ge-Mg Legierung

摘要

An electronic device has at least one electronic portion (8) mounted on a substrate (13). The electronic portion and the substrate are bonded by a joint comprising a phase of aluminum particles (2) and another phase of an aluminum-magnesium-germanium-zinc (Al-Mg-Ge-Zn) alloy (4). The aluminum particles are connected to each other by the Al-Mg-Ge-Zn alloy phase. An independent claim is included for a semiconductor device.