摘要 |
A substrate polishing apparatus for sequentially polishing both sides of a substrate, such as a magnetic disk, and method therefor, are provided. The apparatus according to the present invention may be conveniently considered in terms of it's subassemblies. The apparatus includes a cassette/disk handling robot (104), a disk flip and rinse station (106), an orbiter (110) including disk polish heads (112), a main gantry robot (108) and a magazine (114) having a polish platen (116) and supplying a polish tape or web tape (115) on which the substrate is polished. The disk flip and rinse station (106) receives a substrate from the cassette/disk handling robot (104) and subsequently releases the substrate back to the cassette/disk handling robot (104). The main gantry robot (108) moves the orbiter (110) and the disk polish head (112) to retrieve the substrate from the disk flip and rinse station (106) for polishing and to release the substrate back to the disk flip and rinse station (106) after polishing. The method according to the invention generally comprises the steps of polishing the first side of a substrate, automatically inverting the substrate and polishing the second side.
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申请人 |
EXCLUSIVE DESIGN COMPANY, INC. |
发明人 |
WILLIAMS, ROGER, O.;HOWARD, JEFF;SINGH, TARLOCHAN;JONES, NATHAN;AVEN, JAMES, R.;SERPA, LEROY, J.;LEE, LAWRENCE;VANTUYL, MIKE;HAMILTON, LINDSEY;O'DONNELL, SEAN;HERRMANN, MICHAEL, J.;THOMPSON, KEVIN;NYSTEDT, JON, F.;RICHARDSON, MATT |