发明名称 MANUFACTURING METHOD FOR ELECTRONIC DEVICE, WINDING MANUFACTURING PROCESS, THIN-FILM TRANSISTOR, AND COATING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a speedy and inexpensive high-resolution patterning method for manufacturing electronic devices. <P>SOLUTION: A manufacturing method for the electronic device includes processes of forming a surface energy pattern on a substrate, coating the substrate with a first liquid by using a brush, and forming a pattern of liquid corresponding to the surface energy pattern on the substrate. Furthermore, a thin-film transistor has a conductive layer, a layer of an insulator formed on the conductive layer, a pattern of a conductive substance formed on the layer of the insulator and a first self-organizing single-layer film (SAM), a second SAM formed on the conductive substance, and a semiconductor layer formed on the first SAM and second SAM. Furthermore, a coating device has an ink-absorbing brush head, an ink container connected to the brush head by an ink flow passage, and a conveying belt, and a top surface of the conveying belt faces the brush head. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007129227(A) 申请公布日期 2007.05.24
申请号 JP20060297445 申请日期 2006.11.01
申请人 SEIKO EPSON CORP 发明人 LI SHUNPU;NEWSOME CHRISTOPHER;RUSSEL DAVID;KUGLER THOMAS
分类号 H01L21/288;G03F7/00;H01L21/312;H01L21/336;H01L21/368;H01L29/417;H01L29/786;H01L51/00;H01L51/05;H01L51/40;H01L51/56 主分类号 H01L21/288
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