发明名称 |
Thermally Conductive Interface |
摘要 |
A thermally conductive material is provided as a mixture of a silicone, a ceramic powder, and a curing catalyst. The material may be pre-formed into a pad and each side of the film protected with removable release layers. Each side of the film may also include a coating of an adhesive material that aids in coupling the interface film with a surface. The material may alternatively be produced in a screen-printable paste. As such, a layer of the paste may be screen-printed on a surface as complete sheet form or as a patterned film by using a stencil patterned screen mesh. The interface material is sandwiched between a printed circuit board and a heat sink to form the circuit board assembly. In a multi-step press process, the assembly is cured and a laminate formed. The assembly process may also include a priming function that prepares metal surfaces of the circuit board and heat sink for receiving the interface material.
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申请公布号 |
US2007113399(A1) |
申请公布日期 |
2007.05.24 |
申请号 |
US20060557186 |
申请日期 |
2006.11.07 |
申请人 |
AMERICAN STANDARD CIRCUITS, INC. |
发明人 |
KUMAR SUNDARAM N.;SITES GARY G.;PATEL BHAVIK |
分类号 |
H05K3/20;B32B18/00;H05K3/36 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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