WAFER LEVEL PACKAGE FOR SURFACE ACOUSTIC WAVE DEVICE AND FABRICATION METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a SAW device wafer level package and fabrication method thereof.

SOLUTION: A wafer level package for a SAW device of the present invention includes a SAW device with a SAW element formed on an upper surface of a device wafer; a cap wafer joined on an upper part of the SAW element; a cavity part housing the SAW element between the cap wafer and the SAW device; a cap pad formed on an upper surface of the cap wafer; and a metal line formed to penetrate through the cap wafer to electrically connect the cap pad and the SAW element, the device wafer and the cap wafer being made of the same materials.

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